 Ceramic Housing
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 Technical requirements for CD/CT Series Diode cases :
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1. The outside surface of the ceramic parts of the cases should be glazed.
The following defects are not allowed:
- Cracks
- Cut-offs: diameter more than 0,5 mm and more than 0,2 mm deep
- Impurities, dark spots: diameter more than 0,5 mm
- No glaze: more than 1 mm from end-walls
- Non-glazed surface points: diameter more than 0,5 mm in quantity more than 5 points
- Internal or external metallization leakage: higher than 0,5 mm from the end walls (for ceramic parts H=20mm) and not higher 1,0 mm (for ceramic parts H>20mm).
- Solder leakage, which increase the height of the case.
2. The cases have to be hermetically sealed. Helium leak rate must not exceed 7,5(10-4 Pa(cm3/S).
3. Requirements to thermal and electrical characteristics.
3.1. The diode cases have to be stable to the test voltage with the industrial frequency of 50 Hz, the value is indicated in the following table: |
| Diode Case Model |
Rated test voltage (rms), kV |
| Normal climatic conditions |
High moisture |
| CT3-25 |
5 |
4,5 |
| CD3-25 |
8 |
7 |
| CT3-30 |
5 |
5 |
| CD3-30 |
10 |
7 |
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3.2. The diode cases have to be stable to the temperature change from -70℃ to +200℃.
4. Mechanical stability of the diode cases.
4.1. The diode cases have to be stable to the following mechanical loads:
4.1.1. Sine vibration, frequencies 10-2000 Hz, acceleration 20 g.
4.1.2. Mechanical shock (multiple), peak shock acceleration 150 g, duration 3±1 ms.
 4.1.3. Mechanical shock (single), peak shock acceleration 1000 g, duration 1±0,5 ms.
4.1.4. Rated linear acceleration: long-term= 47088 ms-2 (4800) g, short-term=66708 ms-2 (6800) g, perpendicular to the axis of symmetry.
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